TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone

SAN JOSE, Calif. — TetraMem Inc., a Silicon Valley–based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22nm multi-level RRAM-based analog IMC system-on-chip (SoC). TetraMem achieves an MLX200 multi-level RRAM–based in-memory computing SoC milestone on a commercial TSMC 22nm process,... The post TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone appeared first on Montreal Gazette .

Original source: Montreal Gazette